Semiconductor image pickup device

ABSTRACT

According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority under35 U.S.C. §120 from U.S. Ser. No. 14/671,533, filed Mar. 27, 2015 whichis a continuation of U.S. Ser. No. 13/232,260, filed Sep. 14, 2011 nowU.S. Pat. No. 9,048,156, which claims the benefit of priority from priorJapanese Patent Application No. 2010-251801, filed Nov. 10, 2010, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor imagepickup device.

BACKGROUND

Semiconductor image pickup devices such as CMOS image sensors areincreasingly miniaturized and generally use copper (Cu) wires. Whencopper wires are used, a cap layer such as a silicon nitride film needsto be provided on the copper wire in order to prevent diffusion of thecopper.

However, in a pixel area, a part of the cap layer which is located overa photoelectric conversion element is removed in order to suppressattenuation of light incident on the photoelectric conversion element.On the other hand, non-pixel areas such as a dummy pixel area and ablack reference area do not require suppression of light attenuation.Thus, in these areas, the cap layer is not removed. Hence, during asinter process, the amount of hydrogen supplied to a substrate differsbetween the pixel area and the non-pixel area. As a result,disadvantageously, a dark characteristic and the like may vary betweenthe pixel area and the non-pixel area.

As described above, characteristic differences may conventionally occurbetween the pixel area and the non-pixel area, making production ofexcellent semiconductor image pickup devices difficult.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram schematically showing a general configuration of asemiconductor image pickup device according to an embodiment;

FIG. 2 is a cross-sectional view schematically showing a configurationof the semiconductor image pickup device according to the embodiment;

FIG. 3 is a cross-sectional view schematically illustrating a part of amethod for manufacturing a semiconductor image pickup device accordingto the embodiment;

FIG. 4 is a cross-sectional view schematically illustrating a part ofthe method for manufacturing a semiconductor image pickup deviceaccording to the embodiment;

FIG. 5 is a cross-sectional view schematically illustrating a part ofthe method for manufacturing a semiconductor image pickup deviceaccording to the embodiment;

FIG. 6 is a cross-sectional view schematically illustrating a part ofthe method for manufacturing a semiconductor image pickup deviceaccording to the embodiment; and

FIG. 7 is a cross-sectional view schematically illustrating a part ofthe method for manufacturing a semiconductor image pickup deviceaccording to the embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a semiconductor image pickupdevice includes a pixel area and a non-pixel area. The device includes afirst photoelectric conversion element formed in the pixel area; a firsttransistor formed in the pixel area and connected to the firstphotoelectric conversion element; a second photoelectric conversionelement formed in the non-pixel area; a second transistor formed in thenon-pixel area and connected to the second photoelectric conversionelement; a metal wire formed at least in the non-pixel area; a first caplayer formed on the metal wire to prevent diffusion of metal containedin the metal wire; and a dummy via wire formed in the non-pixel area andpenetrating the first cap layer.

An embodiment will be described below with reference to the drawings.

FIG. 1 is a diagram schematically showing a general configuration of asemiconductor image pickup device (CMOS image sensor) according to theembodiment.

As shown in FIG. 1, the semiconductor image pickup device comprises apixel area 100, a dummy pixel area 200, a black reference area 300, anda circuit area 400.

In the pixel area 100, a plurality of pixels are arranged in a matrix. Aphoto diode (photoelectric conversion element) and a MOS transistor areprovided in each pixel. The dummy pixel area 200 is arranged around theperiphery of the pixel area 100. The dummy pixel area 200 is not usedfor actual image pickup operations but is provided as required for amanufacturing process or the like. The black reference area 300 isconfigured to generate a black reference signal. In non-pixel areas suchas the dummy pixel area 200 and the black reference area 300,photodiodes and MOS transistors are provided as is the case with thepixel area 100. A circuit area including an analog signal circuit and adigital signal circuit is arranged around the periphery of the dummypixel area 200 and the black reference area 300.

FIG. 2 is a cross-sectional view schematically showing a configurationof the semiconductor image pickup device (CMOS image sensor) accordingto the present embodiment.

FIG. 2 shows the pixel area 100 on the right side thereof and the dummypixel area 200 as a non-pixel area on the left side thereof.

As shown in FIG. 2, an isolation area 12 is formed in a surface area ofa semiconductor substrate (silicon substrate) 11.

A photodiode 13 is formed in the pixel area 100 as a photoelectricconversion element. A photodiode 14 is formed in the dummy pixel area200 as a photoelectric conversion element. The photodiode 13 comprisesan N-type area 13 a and a P-type area 13 b. The photodiode 14 comprisesan N-type area 14 a and a P-type area 14 b.

Furthermore, a transistor (MOS transistor) 15 is formed in the pixelarea 100. Transistors (MOS transistors) 16 are formed in the dummy pixelarea 200. The transistor 15 includes a gate electrode 15 a and asource/drain diffusion area 15 b. Each of the transistors 16 includes agate electrode 16a and a source/drain diffusion area 16b. Furthermore,the transistor 15 is connected to the photodiode 13. The transistor 16is connected to the photodiode 14.

An interlayer insulating film 21 is formed on the semiconductorsubstrate 11. Contact holes are formed in the interlayer insulating film21. Contacts 22 comprising, for example, tungsten are formed in therespective contact holes.

An interlayer insulating film 23 is formed on the interlayer insulatingfilm 21. Trenches are formed in the interlayer insulating film 23.Copper wires 24 are formed in the respective trenches as metal wires.The copper wires 24 are formed in the pixel area 100 and the dummy pixelarea 200. However, in order to prevent light incident on the photodiodes13 from being blocked, the copper wire 24 is not formed above thephotodiodes 13 provided in the pixel area 100.

A cap layer (first cap layer) 25 formed of a silicon nitride film or asilicon carbide film is provided on the copper wires 24 and theinterlayer insulating film 23 in order to prevent diffusion of coppercontained in the copper wires 24. However, in order to preventattenuation of light incident on the photodiodes 13, the cap layer 25 isnot formed above the photodiodes 13 provided in the pixel area 100.

An interlayer insulating film 31 is formed on the interlayer insulatingfilm 23 and the cap layer 25. Via holes are formed in the interlayerinsulating film 31. Via wires 32 comprising copper is formed in therespective via holes. In the dummy pixel area 200, a dummy via wire 33comprising copper is formed in a via hole. The dummy via wire 33 is notused for circuit operations. The dummy via wire 33 is connected to thecopper wire 24 through the cap layer 25. Furthermore, a trench is formedin the interlayer insulating film 31. A copper wire 34 is formed in thetrench. The via wire 32, the dummy via wire 33, and the copper wire 34are formed in the same step as described below.

A cap layer (second cap layer) 35 formed of a silicon nitride film or asilicon carbide film is provided on the interlayer insulating film 31 inorder to prevent diffusion of copper. However, in order to preventattenuation of light incident on the photodiodes 13, the cap layer 35 isnot formed above the photodiodes 13 provided in the pixel area 100.

A stack film of a silicon oxide film 41 and a silicon nitride film 42 isformed on the interlayer insulating film 31 and the cap layer 35 as apassivation film. Openings are formed in the passivation film and thecap layer 35. A bonding pad 43 connected to the copper wire 34 is formedin the opening formed in the pixel area 100. Furthermore, a lightshielding film 44 is formed in the opening formed in the dummy pixelarea and on the passivation film. Each of the bonding pad 43 and thelight shielding film 44 is formed of an aluminum film. Here, in thedummy pixel area, an opening is formed above the dummy via wire 33. Theinterlayer insulating film 31 and the copper wire 34 are exposed fromthe opening formed in the dummy pixel area. The light shielding film 44and the copper wire 34 are in contact with each other.

Furthermore, a color filter 45 is formed on the silicon nitride film 42.A micro lens 46 is formed on the color filter 45. The color filter 45and the micro lens 46 are provided above the photodiode 13.

Now, a method for manufacturing a semiconductor image pickup deviceaccording to the present embodiment will be described with reference toFIG. 3 to FIG. 7 and FIG. 2.

First, as shown in FIG. 3, an isolation area 12 is formed on thesemiconductor substrate (silicon substrate) 11. Moreover, a photodiode13 and a transistor 15 are formed in the pixel area 100. photodiode 14and transistors 16 are formed in the dummy pixel area 200.

Then, as shown in FIG. 4, a silicon oxide film is deposited on thesemiconductor substrate 11 as an interlayer insulating film 21. Theinterlayer insulating film 21 is flattened by CMP. Then, contact holesare formed in the interlayer insulating film 21 by photolithography. Thecontact holes are filled with tungsten to form contacts 22.

Then, a silicon oxide film is deposited as an interlayer insulating film23. Subsequently, wiring trenches are formed in the interlayerinsulating film 23 by photolithography. A copper film is deposited allover the surface of the interlayer insulating film 23 and then flattenedby CMP. Thus, copper wires 24 are formed in the trenches as metal wires.

Then, a silicon nitride film is formed all over the resultant surface asa cap layer 25 in order to prevent diffusion of copper contained in thecopper wires 24.

Then, as shown in FIG. 5, a part of the cap layer 25 which is locatedabove the photodiode 13 in the pixel area 100 is removed in order toprevent attenuation of light incident on the photodiode 13 in the pixelarea 100. The cap layer 25 is not removed in the dummy pixel area 200.

Then, as shown in FIG. 6, a silicon oxide film is deposited all over theresultant surface as an interlayer insulating film 31. Subsequently, viaholes are formed in the cap layer 25 and the interlayer insulating film31 by photolithography. Moreover, a wiring trench is formed in theinterlayer insulating film 31 by photolithography. A copper film isdeposited all over the resultant surface and then flattened by CMP.Thus, a via wire 32, a dummy via wire 33, and a copper wire 34 areformed.

Then, a silicon nitride film is formed all over the resultant surface asa cap layer 35 in order to prevent diffusion of copper contained in thecopper wire 34.

Then, as shown in FIG. 7, a part of the cap layer 35 which is locatedabove the photodiode 13 in the pixel area 100 is removed in order toprevent attenuation of light incident on the photodiode 13 in the pixelarea 100.

Then, as shown in FIG. 2, a stack film of a silicon oxide film 41 and asilicon nitride film 42 is formed all over the resultant surface as apassivation film. Subsequently, openings are formed in the silicon oxidefilm 41, the silicon nitride film 42, and the cap layer 35.

Then, an aluminum film is deposited all over the resultant surface. Thealuminum film is patterned so as to form bonding pads 43 and a lightshielding film 44.

Then, in a hydrogen gas atmosphere, the resultant structure is thermallytreated at about 400° C. (sinter process). The sinter process diffuseshydrogen to the surface of the semiconductor substrate 11 so thatdangling bonds at the interface between the semiconductor substrate 11and a gate insulating film (not shown in the drawings) are terminated bythe hydrogen.

During the sinter process, a dummy via wire 33 that fails to function inconnection with circuit operations is formed in the dummy pixel area200. The dummy via wire 33 allows a diffusion path for hydrogen to bereliably provided. That is, given that the dummy via wire 33 is notformed and that the copper wire 24 connected to the dummy via wire 33 isentirely covered with the cap layer 25, the cap layer 25 blocks thediffusion path for hydrogen. Thus, the amount of hydrogen supplied tothe surface of the semiconductor substrate differs significantly betweenthe pixel area 100 and the dummy pixel area 200. This significantlyvaries transistor characteristics. As a result, disadvantageously, thedark characteristic and the like may vary greatly between the pixel area100 and the dummy pixel area 200.

In the present embodiment, the via hole is formed in the cap layer 25and the interlayer insulating film 31, and the dummy via wire 33 isformed in the via hole. Moreover, the part of the cap layer 35 which islocated over the copper wire 34 connected to the dummy via wire 33 (thepart of the cap layer 35 which is located above the dummy via wire 33)is removed. This allows a diffusion path for hydrogen to be reliablyprovided. Furthermore, hydrogen diffuses more easily through the dummyvia wire formed of metal than through the interlayer insulating film 31formed of a silicon oxide film or the like. Thus, also in thisconnection, hydrogen can be reliably diffused. Hence, the amount ofhydrogen supplied to the surface of the semiconductor substrate isprevented from differing significantly between the pixel area 100 andthe dummy pixel area 200. This allows the dark characteristic and thelike to be restrained from varying between the pixel area 100 and thedummy pixel area 200. Therefore, an excellent semiconductor image pickupdevice can be obtained.

After the sinter process ends, a color filter 45 is formed on thesilicon nitride film 42. A micro lens 46 is formed on the color filter45. Thus, the color filter 45 and the micro lens 46 are formed over thephotodiode 13.

Thus, a semiconductor image pickup device configured as shown in FIG. 2is formed.

As described above, in the present embodiment, the dummy via wire 33penetrating the cap layer 25 is provided in the dummy pixel area 200.Furthermore, the cap layer 35 formed on the interlayer insulating film31 includes the opening formed above the dummy via wire 33. Thisconfiguration allows a diffusion path for hydrogen to be reliablyprovided during a sinter process. As a result, the characteristicdifference between the pixel area 100 and the dummy pixel area 200 canbe reduced, resulting in an excellent semiconductor image pickup device.

In the above-described embodiment, the non-pixel area is the dummy pixelarea 200 by way of example. However, the non-pixel area may be the blackreference area 300. Even in this case, effects similar to those of theabove-described embodiment can be exerted. Of course, a configurationsimilar to that described above in the embodiment may be adopted forboth the dummy pixel area 200 and the black reference area 300.

Furthermore, in the above-described embodiment, the copper wire is usedas the metal wire. However, if the cap layer needs to be provided toprevent diffusion of the metal contained in the metal wire, aconfiguration similar to that described above in the embodiment may beadopted even when the metal wire is formed of a metal other than copper.

Additionally, in the above-described embodiment, the silicon nitridefilm or silicon carbide film is used as the cap layer. However, aconfiguration similar to that described above in the embodiment may beadopted even if the cap layer is other than the silicon nitride film orsilicon carbide film, provided that the cap layer suppresses diffusionof the metal used for the metal wire and prevents diffusion of hydrogenduring the sinter process.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

1. (canceled)
 2. A semiconductor image pickup device comprising a pixelarea including a plurality of pixels arranged in a matrix and a dummypixel area arranged outside the pixel area, the device comprising: asemiconductor substrate; a first photoelectric conversion element formedin the pixel area on the semiconductor substrate; a first transistorformed in the pixel area and connected to the first photoelectricconversion element; a second photoelectric conversion element formed inthe non-pixel area on the semiconductor substrate; a second transistorformed in the pixel area and connected to the first photoelectricconversion element; a first interlayer insulating film formed on thesemiconductor substrate; a metal contact formed through the firstinterlayer insulating film and in contact with the semiconductorsubstrate; a first metal wire formed on the first interlayer insulatingfilm and connected to the metal contact; a second interlayer insulatingfilm formed on the first metal wire; a dummy via wire formed in thedummy pixel area, formed directly above and to face the dummy pixelarea, penetrating the second interlayer insulating film, and connectedto the first metal wire; and a second metal wire formed over the dummyvia wire and connected to an upper end of the dummy via wire.
 3. Thedevice according to claim 2, further comprising a first cap layer formedon the first metal wire to prevent diffusion of metal contained in thefirst metal wire, wherein the first metal wire and the first cap layerare not formed over the first photoelectric conversion element.
 4. Thedevice according to claim 3, wherein the dummy via wire is formed in avia hole formed in the first cap layer and the second interlayerinsulating film.
 5. The device according to claim 4, further comprisinga second cap layer formed on the second interlayer insulating film andcomprising an opening over the dummy via wire.
 6. The device accordingto claim 5, wherein the second cap layer is not formed above the firstphotoelectric conversion element.
 7. The device according to claim 5,wherein the second cap layer is formed of a silicon nitride film or asilicon carbide film.
 8. The device according to claim 4, wherein eachof the first and second interlayer insulating films is formed of asilicon oxide film.
 9. The device according to claim 4, wherein thefirst cap layer is formed of a silicon nitride film or a silicon carbidefilm.
 10. The device according to claim 2, wherein the first metal wireis formed of copper.
 11. The device according to claim 2, wherein thedummy via wire is formed of copper.
 12. The device according to claim 2,wherein the dummy via wire is not used for a circuit operation.